Unit and method for transferring substrates and apparatus and method for treating substrates with the unit
US8007218B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2009 |
| Grant date | Aug 30, 2011 |
| Priority date | — |
| Expiry date | Jun 30, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is related to a method for transferring substrates. The method comprise simultaneously transferring two substrates, by means of a transfer unit, between first support plates disposed to be vertically spaced apart from each other and second support plates arranged abreast in a lateral direction. The transfer unit comprises a top blade and a bottom blade converted to a folded state where they are vertically disposed to face each other and an unfolded state where they rotate at a preset angle in opposite directions. The transfer unit place/take a substrate on/out of the first support plates under the folded state and place/take a substrate on/out of the second support plates under the unfolded state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.