Two layer LTO temperature oxide backside seal for a wafer
US8007914B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2003 |
| Grant date | Aug 30, 2011 |
| Priority date | — |
| Expiry date | May 8, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2205
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A two layer LTO backside seal for a wafer. The two layer LTO backside seal includes a low stress LTO layer having a first major side and a second major side, the first major5 side of the low stress LTO layer adjacent to one major side of the wafer. The two layer LTO backside seal further includes a high stress LTO layer having a first major side and second major side, the first major side of the high stress LTO layer adjacent the second major side of the low stress LTO layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.