Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate
US8008121B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2009 |
| Grant date | Aug 30, 2011 |
| Priority date | — |
| Expiry date | Dec 1, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0097
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package has a first conductive via formed through a substrate. The substrate with first conductive via is mounted to a first carrier. A first semiconductor die is mounted to a first surface of the substrate. A first encapsulant is deposited over the first die and first carrier. The first carrier is removed. The first die and substrate with the first encapsulant is mounted to a second carrier. A second semiconductor die is mounted to a second surface of the substrate opposite the first surface of the substrate. A second encapsulant is deposited over the second die. The second carrier is removed. A bump is formed over the second surface of the substrate. A conductive layer can be mounted over the first die. A second conductive via can be formed through the first encapsulant and electrically connected to the first conductive via. The semiconductor packages are stackable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.