Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials
US8008188B2 · kind B2 · utility
2Cited by
12References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2007 |
| Grant date | Aug 30, 2011 |
| Priority date | — |
| Expiry date | Jun 29, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/135
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is provided comprising: coating an electrically conductive core with a first removable material, creating openings in the first removable material to expose portions of the electrically conductive core, plating a conductive material onto the exposed portions of the electrically conductive core, coating the conductive material with a second removable material, removing the first removable material, electrophoretically coating the electrically conductive core with a dielectric coating, and removing the second removable material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.