Crack stops for semiconductor devices
US8008750B2 · kind B2 · utility
5Cited by
8References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2008 |
| Grant date | Aug 30, 2011 |
| Priority date | — |
| Expiry date | Jul 6, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Crack stops for semiconductor devices, semiconductor devices, and methods of manufacturing semiconductor devices are disclosed. In one embodiment, a barrier structure for a semiconductor device includes a plurality of substantially V-shaped regions. Each of the plurality of substantially V-shaped regions is disposed adjacent another of the plurality of substantially V-shaped regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.