Patent · US Active

Bridges for interconnecting interposers in multi-chip integrated circuits

US8008764B2 · kind B2 · utility

35Cited by

4References

18Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Douglas J. Joseph · Danbury, US
John U. Knickerbocker · Wappingers Falls, US

Key dates

Filing date	Apr 28, 2008
Grant date	Aug 30, 2011
Priority date	—
Expiry date	Dec 21, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15311
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A structure and a method for forming the same. The structure includes a substrate, a first interposer on the substrate, a second interposer on the substrate, and a first bridge. The first and second interposers are electrically connected to the substrate. The first bridge is electrically connected to the first and second interposers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.