Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
US8012580B2 · kind B2 · utility
0Cited by
24References
5Claims
0Family size
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Key dates
| Filing date | Aug 3, 2009 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | Feb 18, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/287
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive bonding sheet having an optically transmitting supporting substrate and an adhesive bonding layer, and being used in both a dicing step and a semiconductor element adhesion step, wherein the adhesive bonding layer comprises:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.