LED package and fabricating method thereof
US8012778B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2008 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | Nov 10, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8581
Abstract
The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.