Method of fabricating semiconductor laser
US8012780B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2008 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | Aug 16, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/2009
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
There is provided a method of fabricating a semiconductor laser including a two-dimensional photonic crystal. The method comprises the steps of growing an InX1Ga1−X1N (0<X1<1) layer on a gallium nitride-based semiconductor region in a reactor; after taking out a substrate product including the InX1Ga1−X1N layer from the reactor, forming a plurality of openings for a two-dimensional diffraction grating of the two-dimensional photonic crystal in the InX1Ga1−X1N layer to form a patterned InX1Ga1−X1N layer; and growing an AlX2Ga1−X2N (0≦X2≦1) layer on a top surface of the patterned InX1Ga1−X1N layer to form voids associated with the openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.