Methods and apparatus for testing a component
US8013599B2 · kind B2 · utility
1Cited by
29References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2004 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | Mar 13, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/902
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for inspecting a component having a surface profile that includes a local minima and a local maxima. The method includes positioning an eddy current probe proximate to a surface of the component to generate a first position indication, positioning the eddy current probe proximate to the surface of the component to generate a second position indication that is different than the first position indication, and interpolating between the first and second position indications to determine a profile of a portion of the surface of the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.