Polishing pad and method thereof
US8016647B2 · kind B2 · utility
2Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2007 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Nov 20, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T408/03
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad and fabricating method thereof includes a polishing pad body and at least a compressibility-aiding stripe. The compressibility-aiding stripe is buried in the polishing pad body and has a larger compressibility than that of the polishing pad body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.