Method for manufacturing a surface and integrated circuit using variable shaped beam lithography
US8017289B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2011 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Jan 10, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24479
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method is disclosed in which a plurality of variable shaped beam (VSB) shots is used to form a desired pattern on a surface. In this method some shots within the plurality of shots overlap each other. Additionally, the union of any subset of the plurality of shots differ from the desired pattern. In some embodiments, dosages of the shots vary with respect to each other. In other embodiments, an optimization technique may be used to minimize shot count. In yet other embodiments, the plurality of shots may be optionally selected from one or more pre-computed VSB shots or groups of VSB shots. The method of the present disclosure may be used, for example, in the process of manufacturing an integrated circuit by optical lithography using a reticle, or in the process of manufacturing an integrated circuit using direct write.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.