Patent · US Active

Semiconductor chip package fixture

US8017434B2 · kind B2 · utility

4Cited by

2References

26Claims

0Family size

Assignee

Advanced Micro Devices, Inc. · US

Inventors

Kevin Lim · Seattle, US
Seah Sun Too · Sammamish, US
Azlina N. Nayan · Jeniang, MY
Kee Hean Keok · Kuala Kangsar, MY
Soon Tatt Ow Yong · Bukit Mertajam, MY

Key dates

Filing date	Nov 24, 2008
Grant date	Sep 13, 2011
Priority date	—
Expiry date	Mar 13, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/5327
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Various methods and apparatus for holding a semiconductor chip package are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first plate adapted to hold a semiconductor chip package. The semiconductor chip package includes a carrier substrate and at least one semiconductor chip coupled to the carrier substrate. A second plate is formed with a first opening defining an interior peripheral surface adapted to compress an outer edge of the carrier substrate between the first plate and the second plate without engaging the at least one semiconductor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.