Patent · US Active

Method for packaging electronic devices and integrated circuits

US8017435B2 · kind B2 · utility

6Cited by

6References

8Claims

0Family size

Assignee

Wafer-Level Packaging Portfolio LLC · US

Inventors

Juergen Leib · Freising, DE
Hidefumi Yamamoto · Tokyo, JP

Key dates

Filing date	Jun 1, 2007
Grant date	Sep 13, 2011
Priority date	—
Expiry date	Jul 21, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1461
WIPO fieldBasic communication processes
WIPO sectorElectrical engineering

Abstract

The present invention relates to the field of electronic devices and their associated driver and/or controller integrated circuits and in particular to the mechanical packaging of electronic devices and to the packaging of electronic devices and their associated driver and/or controller integrated circuits.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.