Juergen Leib
9Patents
3h-index
10Co-inventors
50Inventor score
Filing activity: Nov 15, 2004 → Dec 16, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7476623B2 | Method for microstructuring flat glass substrates | Chemistry; Metallurgy | 18 | Expired |
| US8017435B2 | Method for packaging electronic devices and integrated circuits | Electricity | 6 | Active |
| US8420445B2 | Method for packing semiconductor components and product produced according to the method | Electricity | 3 | Active |
| US7700397B2 | Process for packaging components, and packaged components | Electricity | 2 | Active |
| US8324024B2 | Method for production of packaged electronic components, and a packaged electronic component | Electricity | 1 | Active |
| US8309384B2 | Process for packaging components, and packaged components | Electricity | 1 | Active |
| US10898136B2 | Monitoring device for animals | Human Necessities | 1 | Active |
| US8399293B2 | Method for packaging electronic devices and integrated circuits | Electricity | 1 | Active |
| US7566672B2 | Glass composition exclusively consisting of oxides which already at low temperatures form volatile fluorides by reaction with fluorine and its use | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.