Patent · US Active

Method for manufacturing a rigid power module suited for high-voltage applications

US8017446B2 · kind B2 · utility

3Cited by

3References

8Claims

0Family size

Assignee

DANFOSS SILICON POWER GMBH · DE

Inventors

Ronald Eisele · Surendorf, DE
Mathias Kock · Gokels, DE
Teoman Senyildiz · Schleswig, DE

Key dates

Filing date	Mar 24, 2010
Grant date	Sep 13, 2011
Priority date	—
Expiry date	Mar 24, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Method for manufacturing a rigid power module with a layer that is electrically insulating and conducts well thermally and has been deposited as a coating, the structure having sprayed-on particles that are fused to each other, of at least one material that is electrically insulating and conducts well thermally, having the following steps:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.