Patent · US Active

Electronic modules and methods for forming the same

US8017451B2 · kind B2 · utility

11Cited by
88References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 30, 2008
Grant dateSep 13, 2011
Priority date—
Expiry dateSep 28, 2029

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/19043
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.