Printed wiring board
US8017875B2 · kind B2 · utility
5Cited by
15References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2006 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Jun 29, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0557
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed wiring board includes a wiring substrate, one or more conductor circuits provided on the wiring substrate, a solder resist layer provided on a surface of the wiring substrate and having multiple openings, the openings exposing multiple parts of the conductor circuits forming multiple conductor pads for mounting electronic parts, and multiple solder bumps formed on the conductor pads, respectively. The conductor pads are aligned at a pitch of about 200 μm or less, and a ratio W/D of a diameter W of the solder bumps to an opening diameter D of the openings formed in the solder resist layer is about 1.05 to about 1.7.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.