Light-emitting element including a fusion-bonding portion on contact electrodes
US8017967B2 · kind B2 · utility
5Cited by
14References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2008 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Jan 23, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S362/80
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A solid-state device having: a flip-chip mounted solid-state element; a power receiving/feeding portion having a mounting substrate to allow that a mounting surface of the solid-state element forms substantially the same plane as a surface of the mounting substrate; and an inorganic sealing portion made of an inorganic sealing material having a thermal expansion coefficient equal to that of the power receiving/feeding portion for sealing the solid-state element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.