Patent · US Active

Semiconductor die package including multiple semiconductor dice

US8018054B2 · kind B2 · utility

13Cited by

62References

16Claims

0Family size

Assignee

FAIRCHILD SEMICONDUCTOR CORPORATION · US

Inventors

Yong Liu · Yichun City, CN
Qiuxiao Qian · Suzhou, CN

Key dates

Filing date	Mar 12, 2008
Grant date	Sep 13, 2011
Priority date	—
Expiry date	Oct 19, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor die package. The semiconductor die package includes a leadframe structure comprising a first die attach pad, and a second die attach pad laterally spaced from the first die attach pad, a first side and a second side opposite to the first side. The semiconductor die package further includes a first semiconductor die attached the first die attach pad at the first side of the leadframe structure, and a second semiconductor die attached to the second die attach pad at the second side of the leadframe structure. The semiconductor die package further includes a housing material covering at least a portion of the leadframe structure, the first semiconductor die, and the second semiconductor die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.