Methods of manufacturing printed circuit boards
US8020292B1 · kind B1 · utility
15Cited by
15References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2010 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Apr 30, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods of manufacturing printed circuit boards using parallel processes to interconnect with subassemblies are provided. In one embodiment, the invention relates to a method of manufacturing a printed circuit board including providing a core subassembly including at least one metal layer, providing a plurality of one-metal layer carriers after parallel processing each of the plurality of one-metal layer carriers, and attaching at least two of the plurality of one-metal layer carriers with each other and with the core subassembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.