DDI Global Corp.
6Patents
6Active
6Granted
41Portfolio score
Filing activity: Feb 20, 2008 → Feb 17, 2012 · 3 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8020292B1 | Methods of manufacturing printed circuit boards | Emerging Cross-Sectional Technologies | 15 | Active |
| US8156645B2 | Method of manufacturing a multilayer printed wiring board with copper wrap plated hole | Emerging Cross-Sectional Technologies | 2 | Active |
| US8567053B2 | Methods of manufacturing printed circuit boards | Emerging Cross-Sectional Technologies | 1 | Active |
| US8510941B2 | Methods of manufacturing a printed wiring board having copper wrap plated hole | Emerging Cross-Sectional Technologies | 1 | Active |
| US8250751B2 | Method of manufacturing a printed circuit board | Emerging Cross-Sectional Technologies | 0 | Active |
| US8453322B2 | Manufacturing methods of multilayer printed circuit board having stacked via | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.