Fluid delivery mechanism for vacuum wafer processing system
US8020398B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2008 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Mar 26, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The fluid delivery mechanism of the present disclosure provides a solution for use in a single axis of motion that allows the connection of one or more fluid flow paths over a wide range of temperatures into a vacuum environment. The mechanism does not employ flexible tubing that is prone to fatigue, especially at very low temperatures. In one embodiment, a tube is axially moved within a sealed piston to allow for fluid delivery. In a second embodiment, bellows are used to provide the required functionality. In another embodiment, it is possible to achieve movement in two or more axis of motion by utilizing two or more appropriately configured mechanisms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.