Method of attaching components to fluid delivery systems using diffusion bonding

US8020750B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Mark Crockett · Foster City, US
• John W. Lane · Austin, US
• Micahel DeChellis · Austin, US
• Chris Melcer · Sunnyvale, US
• Erica Porras · San Jose, US
• Aneesh Khullar · Sunnyvale, US
• Balarabe Mohammed · Union City, US

Key dates

• Filing date: Oct 24, 2006
• Grant date: Sep 20, 2011
• Expiry date: Jan 11, 2028

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49906
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and may be partially integrated or fully integrated into a processing chamber which also includes diffusion bonded layers.