Preserving filled features when vacuum wiping
US8021594B2 · kind B2 · utility
0Cited by
9References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2009 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Jun 22, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/0002
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method/process for curing imprint on a template prior to contact with a substrate. A curing process is used to adhere the imprint to a wafer or substrate. Monomer is deposited on a template and then partially cured using a UV exposure. The exposure is controlled so that the imprint is cured past the gel point, but still retains a thin liquid layer of uncured monomer at the surface that will bond with the wafer. Further, this partially cured layer enables the alignment adjustments between the template and the substrate to be performed after contact between the two without pulling any monomer out of the features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.