Printed circuit board and method of manufacturing the same
US8022306B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2009 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Mar 27, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mounting region is provided at a substantially center of one surface of an insulating layer. A metal layer is provided on the other surface of the insulating layer. A slit is formed to cross a region (an opposite region) of the metal layer that coincides with the mounting region and to divide the metal layer. A plurality of regions (large regions) of the metal layer divided by the slit each include a partial region (small region) of the opposite region. The area of each large region is set corresponding to the area of the small region included therein. Specifically, the small region having the area of A [%] with respect to the whole area of the opposite region is included in the large region having the area of (A±δ) [%] with respect to the whole area of the metal layer. Here, δ is an acceptable error range, and the acceptable error range δ is not more than (A×0.3).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.