Inventor · Osaka, JP

Hirofumi EBE

13Patents
1h-index
25Co-inventors
46Inventor score

Filing activity: Jun 27, 2008 → Mar 24, 2016

Most-cited inventions

PatentTitleAreaCited byStatus
US8354599B2 Connection structure between printed circuit board and electronic component Emerging Cross-Sectional Technologies 2 Active
US8097814B2 Printed circuit board and method of manufacturing the same Emerging Cross-Sectional Technologies 1 Active
US8022306B2 Printed circuit board and method of manufacturing the same Electricity 1 Active
US9357645B2 Joining sheet, electronic component, and producing method thereof Emerging Cross-Sectional Technologies 1 Active
US7659605B2 COF board Emerging Cross-Sectional Technologies 1 Active
US8642686B2 Paste composition and printed circuit board Emerging Cross-Sectional Technologies 0 Active
US8822048B2 Paste composition and printed circuit board Emerging Cross-Sectional Technologies 0 Active
US9844147B2 Method for producing soft magnetic film laminate circuit board Electricity 0 Active
US8581110B2 Printed circuit board and method of manufacturing the same Electricity 0 Active
US10418161B2 Soft magnetic particle powder, soft magnetic resin composition, soft magnetic film, soft magnetic film laminated circuit board, and position detection device Electricity 0 Active
US8102664B2 Printed circuit board and method of manufacturing the same Emerging Cross-Sectional Technologies 0 Active
US10867729B2 Method for producing sintered body that forms rare-earth permanent magnet and has non-parallel easy magnetization axis orientation Electricity 0 Active
US10373749B2 Soft magnetic particle powder, soft magnetic resin composition, soft magnetic film, soft magnetic film laminated circuit board, and position detection device General 0 Revoked

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.