Solder composition for electronic devices
US8022551B2 · kind B2 · utility
11Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2006 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Apr 20, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, or other materials and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.