Mounting substrate and manufacturing method thereof
US8022553B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2008 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Feb 12, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09472
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mounting substrate and a method of manufacturing the mounting substrate. The mounting substrate can include an insulation layer, a bonding pad buried in one side of the insulation layer in correspondence with a mounting position of a chip, and a circuit pattern electrically connected to the bonding pad. By utilizing certain embodiments of the invention, the process for stacking a solder resist layer can be omitted, as the bonding pads can be implemented in a form recessed from the surface of the insulation layer. In this way, the manufacturing process can be simplified and manufacturing costs can be reduced. Since the surface of the mounting-substrate on which to mount a chip can be kept flat without any protuberances, the occurrence of voids in the underfill can be minimized. This is correlated to obtaining a high degree of reliability, and leads to a greater likelihood of successful mounting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.