Printed circuit board unit and semiconductor package
US8023268B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2009 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Aug 26, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D48/043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A terminal bump set including the outermost bump row inscribed in a first prism standing upright on the front surface of a package substrate. A heat conductive member contacts with the surface of the semiconductor element. The heat conductive member extends outward beyond the contour of the semiconductor element. A reinforcing member is interposed between the heat conductive member and the package substrate outside the contour of the semiconductor element. The reinforcing member is bonded to the front surface of the package substrate at a predetermined bonding area. The predetermined bonding area extends inward from the outer periphery of the package substrate over the front surface of the package substrate. The second prism stands upright on the front surface of the package substrate inside the first prism so as to allow the outermost bump row to circumscribe the second prism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.