Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility
US8024065B2 · kind B2 · utility
2Cited by
80References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2008 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Apr 23, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67276
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one aspect, a method is provided for electronic device manufacturing. The method includes receiving a request to transfer a carrier to or from a first substrate loading station of an electronic device manufacturing facility, and assigning one of a plurality of carrier supports to carry out the transfer based on a spacing on either side of the assigned carrier being greater than an acceptable spacing. Numerous other aspects are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.