Method for manufacturing electronic circuit component
US8026185B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 3, 2007 |
| Grant date | Sep 27, 2011 |
| Priority date | — |
| Expiry date | Nov 14, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K10/466
Abstract
An object of the present invention is to provide a method for manufacturing an electronic circuit component such as an organic TFT 1, which can manufacture an electronic circuit component excellent in reliability and having quality on a practical level, because an insulating layer and a conductive layer which have more excellent characteristics can be formed, particularly, on a general-purpose plastic substrate or the like by treatment at a process temperature of 200° C. or lower which has no influence on the above-mentioned plastic substrate.The method for manufacturing an electronic circuit component according to the invention includes heating a layer containing at least one of a polyimide and a precursor thereof at a temperature of 200° C. or lower to form an insulating layer 4 having a contact angle with water of 80° or more, forming a coating film including a dispersion containing metal nanoparticles on the above-mentioned insulating layer 4 and heating the above-mentioned coating film at a temperature of 200° C. or lower to form a conductive layer such as a source layer 5 or a drain layer 6.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.