Die package and method of manufacturing the same
US8026590B2 · kind B2 · utility
4Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2009 |
| Grant date | Sep 27, 2011 |
| Priority date | — |
| Expiry date | Feb 15, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are a die package and a method of manufacturing the die package. A solder layer is formed on a lower surface of a die. The die is self-aligned and attached to a support plate using surface tension between the solder layer and a metal layer of the support plate, thus reducing attachment lead time of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.