Patent · US Active

Semiconductor device comprising a plastic housing, a semiconductor chip and an interposer including a convex or concave lens-shape top side fitting shape

US8026618B2 · kind B2 · utility

0Cited by

4References

14Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Erich Syri · Wenzenbach, DE
Gerold Gruendler · Regensburg, DE
Juergen Hoegerl · Regensburg, DE
Thomas Killer · Hohenschambach, DE
Volker Strutz · Tegernheim, DE

Key dates

Filing date	Jun 8, 2007
Grant date	Sep 27, 2011
Priority date	—
Expiry date	Aug 2, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH10F77/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device includes a plastic housing and a semiconductor chip, wherein the semiconductor chip includes an active top side and a rear side. An interposer is arranged on the active top side of the semiconductor chip. At least a portion of the interposer is embedded into the plastic housing, while the top side of the interposer forms the top side of the semiconductor device. A top side fitting shape is arranged on the top side of the interposer, where the top side fitting shape has a predetermined radius of curvature that is free of plastic housing composition, and the top side fitting shape has a convex or concave lens-shaped sphere segment shape.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.