Liquid-cooled electronics apparatus and methods of fabrication
US8027162B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2009 |
| Grant date | Sep 27, 2011 |
| Priority date | — |
| Expiry date | Nov 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2079
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Liquid-cooled electronics apparatuses and methods are provided. The cooled electronics apparatuses include a liquid-cooled cold rail and an electronics subassembly. The liquid-cooled cold rail has a thermally conductive structure and a coolant-carrying channel extending within and cooling the thermally conductive structure. The electronics subassembly includes an electronics card(s) and one or more thermal transfer plates. The electronics card(s) includes electronic devices to be cooled, and the one or more thermal transfer plates are each rigidly affixed to one or more electronic devices of the electronics card(s). Each thermal transfer plate is thermally conductive and couples the electronics subassembly to the liquid-cooled cold rail to thermally interface the one or more electronic devices to the liquid-cooled cold rail to facilitate cooling of the electronic devices. In one embodiment, the electronics subassembly includes multiple interleaved electronics cards and thermal transfer plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.