Wireless radio frequency technique design and method for testing of integrated circuits and wafers
US8028208B2 · kind B2 · utility
11Cited by
82References
63Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 26, 2007 |
| Grant date | Sep 27, 2011 |
| Priority date | — |
| Expiry date | Jul 28, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Various embodiments are described herein for an apparatus and method for the wireless testing of Integrated Circuits and wafers. In one embodiment, the apparatus comprises a test unit external from the wafer and at least one test circuit that is fabricated on the wafer that contains the Integrated Circuit. The test unit transmits an RF signal to power the test circuit. The test circuit, comprising configurable circuitry, performs a series of parametric tests at the normal operating frequency of the Integrated Circuit and transmits the test results to the test unit for analysis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.