Methods of fabricating coplanar waveguide structures
US8028406B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2008 |
| Grant date | Oct 4, 2011 |
| Priority date | — |
| Expiry date | Aug 4, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49162
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Methods for fabricating a coplanar waveguide structure. The method may include forming first and second ground conductors and a signal conductor in a coplanar arrangement between the first and second ground conductors, forming a first coplanar array of substantially parallel shield conductors above the signal conductor and the first and second ground conductors, and forming a second coplanar array of substantially parallel shield conductors below the signal conductor and the first and second ground conductors. The method further includes forming a first plurality of conductive bridges located laterally between the signal conductor and the first ground conductor, and forming a second plurality of conductive bridges located laterally between the signal conductor and the second ground conductor. Each of the first plurality of conductive bridges connects one of the shield conductors in the first array with one of the shield conductors in the second array. Each of the second plurality of conductive bridges connects one of the shield conductors in the first array with one of the shield conductors in the second array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.