Light emitting diode package having anodized insulation layer and fabrication method therefor
US8030762B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2007 |
| Grant date | Oct 4, 2011 |
| Priority date | — |
| Expiry date | Jun 11, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.