Bump structure with annular support
US8030767B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2007 |
| Grant date | Oct 4, 2011 |
| Priority date | — |
| Expiry date | Mar 7, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0597
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bump structure with an annular support suitable for being disposed on a substrate is provided. The substrate has at least one pad and a passivation layer that has at least one opening exposing a portion of the pad. The bump structure with the annular support includes an under ball metal (UBM) layer, a bump, and an annular support. The UBM layer is disposed on the passivation layer and covers the pad exposed by the passivation layer. The bump is disposed on the UBM layer over the pad, and a diameter of a lower surface of the bump is less than the diameter of an upper surface thereof. The annular support surrounds and contacts the bump, and a material of the annular support is photoresist. An under cut effect is not apt to happen on the bump structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.