Patent assignee · BM · COMPANY

Chipmos Technologies (Bermuda) Ltd

90Patents
65Active
90Granted
47Portfolio score

Filing activity: Jul 19, 2002 → Aug 15, 2011 · 62 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US6946860B2 Modularized probe head Physics 57 Expired
US7662667B2 Die rearrangement package structure using layout process to form a compliant configuration Electricity 43 Active
US7088118B2 Modularized probe card for high frequency probing Physics 37 Expired
US7915690B2 Die rearrangement package structure using layout process to form a compliant configuration Electricity 22 Active
US7436074B2 Chip package without core and stacked chip package structure thereof Electricity 21 Expired
US7927922B2 Dice rearrangement package structure using layout process to form a compliant configuration Electricity 19 Active
US7129730B2 Probe card assembly Electricity 19 Expired
US6853205B1 Probe card assembly Physics 18 Expired
US6686615B1 Flip-chip type semiconductor device for reducing signal skew Electricity 17 Expired
US7723853B2 Chip package without core and stacked chip package structure Electricity 16 Active
US7663246B2 Stacked chip packaging with heat sink structure Electricity 15 Active
US6703075B1 Wafer treating method for making adhesive dies Electricity 14 Expired
US7615853B2 Chip-stacked package structure having leadframe with multi-piece bus bar Electricity 13 Active
US7662672B2 Manufacturing process of leadframe-based BGA packages Emerging Cross-Sectional Technologies 13 Active
US7582953B2 Package structure with leadframe on offset chip-stacked structure Electricity 12 Active
US6621710B1 Modular probe card assembly Electricity 12 Expired
US7816771B2 Stacked chip package structure with leadframe having inner leads with transfer pad Electricity 11 Active
US7554197B2 High frequency IC package and method for fabricating the same Electricity 9 Active
US7888172B2 Chip stacked structure and the forming method Emerging Cross-Sectional Technologies 9 Active
US7372286B2 Modular probe card Physics 8 Expired
US7170160B1 Chip structure and stacked-chip package Electricity 8 Expired
US6689638B2 Substrate-on-chip packaging process Electricity 8 Expired
US7498251B2 Redistribution circuit structure Emerging Cross-Sectional Technologies 7 Active
US7952198B2 BGA package with leads on chip Electricity 5 Active
US7528495B2 Chip structure Electricity 5 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.