Method of making a molded interconnect device
US8033014B2 · kind B2 · utility
9Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2008 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Feb 8, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method of making a molded interconnect device. The method includes the steps of: injection molding a plastic body having thereon at least one patterned circuit trench structure; and filling a conductive material into the patterned circuit trench structure thereby forming a circuit trace on the plastic body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.