Patent · US Active

Semiconductor device

US8035224B2 · kind B2 · utility

4Cited by

10References

9Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Gerhard Poeppel · Duggendorf, DE
Irmgard Escher-Poeppel · Regensburg, DE

Key dates

Filing date	Nov 14, 2008
Grant date	Oct 11, 2011
Priority date	—
Expiry date	May 24, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19104
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package includes a semiconductor chip having an integrated circuit, a functional element electrically coupled with the integrated circuit, and an array of contact elements connected with the integrated circuit and the functional element. The functional element is configured to protect the integrated circuit from transient voltage.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.