Printed wiring board with built-in semiconductor element, and process for producing the same
US8035979B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 13, 2010 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Dec 13, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad. Upper and side surfaces of the built-in semiconductor element are covered with a first insulating film formed by filling a sealing material. The first insulating film is covered with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.