Spin head, method of operating the spin head and apparatus for treating substrates with the spin head
US8038838B2 · kind B2 · utility
4Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2007 |
| Grant date | Oct 18, 2011 |
| Priority date | — |
| Expiry date | Jun 18, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A spin head includes chucking pins configures to chuck and unchuck a substrate. Contact portions of the chucking pins and the substrate are varied during a process to prevent a treating solution from remaining at the contact portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.