Abrasive liquid for metal and method for polishing
US8038898B2 · kind B2 · utility
1Cited by
33References
15Claims
0Family size
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Key dates
| Filing date | Nov 24, 2004 |
| Grant date | Oct 18, 2011 |
| Priority date | — |
| Expiry date | Nov 24, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An abrasive liquid for a metal comprising (1) an oxidizing agent for a metal, (2) a dissolving agent for an oxidized metal, (3) a first protecting film-forming agent such as an amino acid or an azole which adsorbs physically on the surface of the metal and/or forms a chemical bond, to thereby form a protecting film, (4) a second protecting film-forming agent such as polyacrylic acid, polyamido acid or a salt thereof which assists the first protecting film-forming agent in forming a protecting film and (5) water; and a method for polishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.