Patent · US Active

3D integration of vertical components in reconstituted substrates

US8039306B2 · kind B2 · utility

1Cited by

23References

26Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Francois Baleras · Seyssinet-Pariset, FR
Jean-Charles Souriau · Pessac, FR
Gilles Poupon · Seyssinet-Pariset, FR
Sophie Verrun · Grenoble, FR

Key dates

Filing date	Jun 5, 2008
Grant date	Oct 18, 2011
Priority date	—
Expiry date	Jun 5, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A reconstituted electronic device including: a first face and a second face; a plurality of individual chips placed perpendicular to the faces, each individual chip carrying, on one of its surfaces, at least one component, tracks, and a connection mechanism that are flush with one or other of the faces of the reconstituted electronic device; and an encapsulant that encapsulates the individual chips.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.