Patent · US Active

System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices

US8039318B1 · kind B1 · utility

1Cited by

5References

12Claims

0Family size

Assignee

Marvell International Technology Ltd · BM

Inventors

Randall D. Briggs · Boise, US
Michael D. Cusack · Meridian, US

Key dates

Filing date	Nov 18, 2009
Grant date	Oct 18, 2011
Priority date	—
Expiry date	Nov 18, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit includes a first and a second die positioned on a lead frame of a package. The lead frame includes a plurality of bond fingers. The integrated circuit includes a first bond pad on the first die that is electrically interconnected to a corresponding second bond pad on the second die through first and second bond fingers of the lead frame. The package may be a QFP, DIP, PLCC, TSOP, or any other type of package including a lead frame.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.