Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same
US8039937B2 · kind B2 · utility
1Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2009 |
| Grant date | Oct 18, 2011 |
| Priority date | — |
| Expiry date | Mar 19, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are methods of fabricating semiconductor chips, semiconductor chips formed by the methods, and chip-stack packages having the semiconductor chips. One embodiment specifies a method that includes patterning a scribe line region of a semiconductor substrate to form a semiconductor strut spaced apart from edges of a chip region of the semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.