Inventor · Seongnam-si, KR

Ju-Il Choi

64Patents
6h-index
90Co-inventors
71Inventor score

Filing activity: Nov 6, 2006 → May 20, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US9461007B2 Wafer-to-wafer bonding structure Electricity 211 Active
US8575760B2 Semiconductor devices having electrodes Electricity 15 Active
US8513802B2 Multi-chip package having semiconductor chips of different thicknesses from each other and related device Electricity 11 Active
US9530706B2 Semiconductor devices having hybrid stacking structures and methods of fabricating the same Electricity 9 Active
US9831202B2 Semiconductor devices with solder-based connection terminals and method of forming the same Electricity 7 Active
US9735090B2 Integrated circuit devices having through-silicon vias and methods of manufacturing such devices Electricity 7 Active
US8872306B2 Electrical interconnection structures including stress buffer layers Electricity 6 Active
US10325869B2 Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices Electricity 5 Active
US11676887B2 Semiconductor package Electricity 5 Active
US9728490B2 Semiconductor devices and methods of manufacturing the same Electricity 5 Active
US7875552B2 Methods of forming integrated circuit chips having vertically extended through-substrate vias therein and chips formed thereby Electricity 4 Active
US8088648B2 Method of manufacturing a chip stack package Electricity 4 Active
US7544538B2 Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same Electricity 3 Active
US9006902B2 Semiconductor devices having through silicon vias and methods of fabricating the same Electricity 3 Active
US8987869B2 Integrated circuit devices including through-silicon-vias having integral contact pads Electricity 3 Active
US10128168B2 Integrated circuit device including through-silicon via structure and method of manufacturing the same Electricity 3 Active
US10049997B2 Semiconductor device and method of fabricating the same Electricity 2 Active
US7897511B2 Wafer-level stack package and method of fabricating the same Electricity 2 Active
US8629059B2 Methods of forming integrated circuit chips having vertically extended through-substrate vias therein Electricity 2 Active
US11742271B2 Semiconductor package Electricity 2 Active
US10777487B2 Integrated circuit device including through-silicon via structure and method of manufacturing the same Electricity 1 Active
US10763163B2 Integrated circuit device and method of manufacturing the same Electricity 1 Active
US9543200B2 Methods for fabricating semiconductor devices having through electrodes Electricity 1 Active
US10020273B2 Semiconductor devices and methods of forming the same Electricity 1 Active
US8039937B2 Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same Electricity 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.