Methods and systems for detecting defects on a reticle
US8041106B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2008 |
| Grant date | Oct 18, 2011 |
| Priority date | — |
| Expiry date | May 10, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and systems for detecting defects on a reticle are provided. One method includes printing a single die reticle in first areas of a wafer using different values of a parameter of a lithography process and at least one second area using a nominal value of the parameter. The method also includes acquiring first images of the first areas and second image(s) of the at least one second area. In addition, the method includes separately comparing the first images acquired for different first areas to at least one of the second image(s). The method further includes detecting defects on the reticle based on first portions of the first images in which variations in the first images compared to the at least one second image are greater than second portions of the first images and the first portions that are common to two or more of the first images.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.